How to choose high-performance thermal paste to improve the heat dissipation of computer CPU and GPU?

With the popularity of computers, chip technology continues to upgrade. As the core component of the computer, the chip generates a lot of heat during operation, which makes the heat dissipation of the CPU and GPU a key issue of concern in the industry. As we all know, excessive chip temperature will cause the computer to run slower, or even freeze or freeze. At present, computers are usually equipped with a dedicated CPU radiator to reduce the chip temperature, but is the radiator alone enough? The answer is no - thermal paste is also needed between the chip and the radiator to achieve efficient heat dissipation. As a key heat-conducting medium, thermal paste can quickly transfer the heat generated by the chip to the radiator, thereby significantly improving the heat dissipation efficiency.

So, how to choose high-performance thermal paste to optimize the heat dissipation effect of the chip? Nuomi Chemical (Shenzhen) Co., Ltd., which has been deeply involved in the field of thermal interface materials (TIM) for nearly ten years, will analyze this technical challenge for you through material innovation.

Core performance indicators of thermal paste:

Thermal conductivity: 16.6W/m-K (far exceeding the industry average)

Viscosity: 220,000 cps (to ensure even application of the paste)

Temperature range: -50℃~200℃ (adaptable to extreme working environments)

Application scenarios:

In addition to computer CPU/GPU, it can also be used for game consoles (such as PS4/PS5) chips and other high-heat electronic products. Our products are widely recognized in the consumer market and are committed to providing high-quality solutions to global partners