Thermal Paste For Chip

Product details:

Thermal paste for chip products are suitable for a wide temperature range of -50℃ to 200℃, have excellent aging resistance, and significantly improve the operating stability and life of the equipment. With a complete industrial chain and customized services, it has established long-term cooperation with leading companies such as BYD and continues to promote the development of electronic heat dissipation materials.

1. Nuomi Chemical has been deeply involved in China thermal paste industry and has many years of R&D and production experience in the field of thermal paste for chip. Relying on its independently developed core technology, the company has created BS-139 thermal paste for chip products suitable for chips. Its professional thermal paste product series adapted to high-power chips, advanced packaging processes and complex working conditions helps 5G communications, artificial intelligence, new energy vehicles, data centers and other cutting-edge fields to achieve precise heat dissipation.

2. The thermal conductivity of BS-139 thermal paste for chip covers the range of 5-13.9W/m·K, which can significantly reduce the thermal resistance of the chip and radiator interface, quickly export the heat generated when the chip is running, and ensure the stability of the equipment under overclocking or high-load conditions.

3. BS-139 thermal paste for chip maintains excellent structural stability in the extreme temperature range of -50℃ to 200℃, without volatilization or oil leakage, avoiding chip performance degradation due to aging and extending the service life of the equipment.

4. Product parameter table:

5. BS-139 thermal paste for chip can serve multiple industries 5G communication chips: solve the instantaneous high heat problem caused by high-frequency signal processing; AI/GPU chips: ensure continuous heat dissipation requirements in high-performance computing scenarios; Automotive-grade chips: adapt to complex vehicle environments through high temperature resistance and vibration resistance tests; Consumer electronics: used for chip heat dissipation of mobile phones, tablets and other devices to improve user experience. In response to the heat dissipation needs of different chips, Nuomi Chemical provides customized solutions for chip thermal paste, including thermal conductivity adjustment, viscosity adaptation and special packaging design.

6. Usage: Use alcohol cotton pads to thoroughly remove the old silicone grease and dust on the contact surface of the processor and radiator to ensure no residue. Take a pea-sized BS-139 thermal paste for chip, and use a scraper to evenly cover the CPU/GPU core area with the "center point diffusion method". The thickness is recommended to be 0.13-0.2mm. In order to optimize the performance of the thermal paste, please let it stand for at least 15 minutes before installing the radiator. Press the heat sink vertically and fix the screws. Use balanced pressure to fully fill the micro gaps with thermal paste to avoid bubbles.

Please attention that excessive application should be avoided. Unopened products should be stored in a cool and dry place. Please use as soon as possible after opening. Please be careful not to get it into your eyes when handling.