Graphic Cards Thermal Paste

As a professional manufacturer of graphic cards thermal paste, we have developed JLJ--133 graphics card thermal paste, which can effectively solve the problem of heat dissipation from graphics cards. Its thermal conductivity is as high as 13.3W/m·k, which is much higher than the original graphics card thermal paste on general graphics cards. The thermal conductivity of 8.5W/m·k. Therefore, this JLJ-133 thermal paste is absolutely no problem, and JLJ-133 thermal paste has also passed international certifications such as CE, RoHs, and MSDS.

Product details description:

1. As China's leading R&D and manufacturing company of graphic cards thermal paste, Nuomi's computer graphics card thermal paste JLJ--133 has an ultra-high thermal conductivity of 13.3W/m·k as a star product, which significantly improves the heat dissipation performance of graphics cards. JLJ-133 graphics card thermal paste has been successfully applied to the customized heat dissipation solutions of many flagship graphics cards.

2. Molecular structure optimization: LJ-133 graphics card thermal paste uses nano-aluminum oxide and boron nitride composite fillers to form a denser heat transfer network;

3. Improved wettability: The low viscosity formula can completely fill the 0.2mm micro-gap between the graphics card and the radiator;

4. Long-term stability: There is no phase change volatilization under -50℃ to 200℃ working conditions, and the continuous service life exceeds 5 years.

5. Product parameter table:

6. Scope of use: LJ-133 graphics card thermal paste supports the filling between the chip and the radiator of graphic cards thermal paste such as RTX 40/50 series and Radeon RX 7000/8000 series, which can reduce the full load temperature by 8-12℃‌. It is also used for thermal filling of the main control chip, PLC module and heat dissipation substrate of industrial automation equipment. graphic cards thermal paste can cover the gap between the chip and the radiator of 0.01-0.3mm, adapt to various special-shaped heat dissipation structures, and can form an efficient heat transfer interface with copper, aluminum, nickel-plated metal and ceramic heat sinks. Through high temperature resistance, anti-aging and electrical insulation characteristics, it can achieve more than 5 years of long-term heat dissipation guarantee‌‌‌‌.

7. Usage and precautions: Use alcohol cotton pads to clean the surface of the graphic cards thermal paste and radiator until there are no impurities. It can be directly applied or filled with a scraper, brush, glass rod or syringe. The thickness is recommended to be 0.13-0.2mm. During use, please let it stand for at least 15 minutes before installing the radiator. Sometimes a small amount of air will be trapped, which can be removed by standing, pressurizing or vacuuming.

Please attention to avoid excessive application. Store unopened products in a cool and dry place. Use as soon as possible after opening. Be careful not to get it into your eyes when handling.