As an efficient bonding material in the industrial field, epoxy adhesives play an irreplaceable role in the electronics, construction, automotive and other industries with excellent bonding performance, wide applicability and stable chemical properties, and have become the core choice of bonding solutions.
Super strong bonding is its core competitiveness. After curing, epoxy adhesives form a three-dimensional network structure, and the bonding strength to metals, ceramics, glass and other materials can reach 20-50MPa, far exceeding ordinary acrylic adhesives (8-15MPa). In the bonding of motor core laminations, its shear strength is ≥30MPa, which can withstand the centrifugal force during high-speed operation, ensure that the core does not loosen, and improve the operating stability by more than 40%.
It is widely applicable to materials and has excellent compatibility. Whether it is polar materials (such as aluminum alloys, concrete) or non-polar materials (surface-treated polyethylene), epoxy adhesives can achieve effective bonding. In the new energy battery pack process, it can simultaneously bond the battery shell (stainless steel) and the thermal gasket (silicone), and the sealing performance of the bonding surface reaches IP67 level, meeting the requirements of waterproof and dustproof, and adapting to complex multi-material assembly scenarios.
Outstanding environmental resistance ensures long-term reliability. The cured epoxy adhesive can maintain stable performance in the temperature range of -50℃ to 150℃. After being placed in a hot and humid environment (relative humidity 95%, temperature 40℃) for 1000 hours, the bonding strength retention rate is still ≥80%. In chemical pipeline bonding, its acid and alkali corrosion resistance (can tolerate media with a pH value of 2-12) far exceeds that of polyurethane adhesives, and its service life is extended to more than 10 years.
Construction flexibility meets the needs of multiple processes. Epoxy adhesives can control the curing time by adjusting the curing agent ratio (from 5 minutes of fast curing to 24 hours of slow curing) to adapt to different production rhythms. In electronic component packaging, low-viscosity models (≤500mPa・s) can achieve self-leveling potting, and high-viscosity models (≥5000mPa・s) are suitable for vertical bonding without flowing, meeting the dual needs of fine assembly and structural reinforcement.
From the precise bonding of microelectronic components to the structural reinforcement of large industrial equipment, epoxy adhesives continue to promote the upgrading of bonding technology in various industries with their comprehensive advantages of "strong bonding, wide adaptability, environmental resistance, and easy construction", becoming a key material for improving product reliability.
